Display device

ABSTRACT

A display device including: a substrate element including a base layer, a circuit layer, and a device layer, the base layer forming a plane defined by a first direction and a second direction perpendicular to each other; an encapsulation element provided on the substrate element to seal the device layer; a sealing element provided along edges of the encapsulation element to connect the encapsulation and substrate elements to each other; an optical element provided on the encapsulation element; a window element provided on the substrate element; an adhesive element provided between the optical and window elements to connect the optical element to the window element; and a filling element provided between the window element and the substrate element, wherein the filling element is spaced apart from the optical element and the adhesive element, and is overlapped with the sealing element when viewed in a direction normal to the plane.

CROSS-REFERENCE TO RELATED APPLICATIONS

This U.S. non-provisional patent application is a continuation of U.S.patent application Ser. No. 17/076,050 filed on Oct. 21, 2020, which isa continuation of U.S. patent application Ser. No. 16/239,141 filed onJan. 3, 2019, now U.S. Pat. No. 10,832,982 issued on Nov. 10, 2020 whichclaims priority under 35 U.S.C. § 119 to Korean Patent Application Nos.10-2018-0001424 and 10-2018-0039477, filed on Jan. 4, 2018 and Apr. 5,2018, respectively, the disclosures of which are incorporated byreference herein in their entireties.

TECHNICAL FIELD

The present inventive concept relates to a display device, and inparticular, to a display device with high reliability.

DISCUSSION OF RELATED ART

Various display devices are being developed. For example, variousdisplay devices are being developed for use in multimedia devices suchas televisions, mobile phones, navigation systems, computer monitors,gaming machines, and the like. Various components are assembled tofabricate a display device. The display device is generally designed sothat it can function reliably.

SUMMARY

According to an exemplary embodiment of the inventive concept, a displaydevice may include a substrate element including a base layer, a circuitlayer provided on the base layer, and a device layer electricallyconnected to the circuit layer, wherein the device layer is configuredto generate light, and the base layer forms a plane defined by a firstdirection and a second direction perpendicular to each other. Thedisplay device further includes an encapsulation element provided on thesubstrate element to seal the device layer, a sealing element providedalong edge regions of the encapsulation element to connect theencapsulation and substrate elements to each other, an optical elementprovided on the encapsulation element, a window element provided on thesubstrate element, an adhesive element provided between the opticalelement and the window element to connect the optical element to thewindow element, and a filling element provided between the window andsubstrate elements, wherein the filling element is spaced apart from theoptical and adhesive elements, and is overlapped with the sealingelement when viewed in a direction normal to the plane.

In an exemplary embodiment of the inventive concept, the sealing elementmay include an inner side surface defining a hermetically-sealedinternal space, along with the substrate element and the encapsulationelement, and an outer side surface facing the inner side surface, and aportion of the outer side surface may be in contact with the fillingelement.

In an exemplary embodiment of the inventive concept, a bottom surface ofthe filling element may be in contact with a portion of a top surface ofthe encapsulation element, a side surface of the encapsulation elementadjacent to the filling element, a portion of a bottom surface of theencapsulation element adjacent to the side surface of the encapsulationelement, the outer side surface of the sealing element, and a portion ofa top surface of the substrate element.

In an exemplary embodiment of the inventive concept, when measured inthe second direction, a width of the filling element may be larger thana width of the sealing element, and the filling element may cover thesealing element, when viewed in the direction normal to the plane.

In an exemplary embodiment of the inventive concept, the display devicemay further include a driver chip mounted on the substrate element. Thesubstrate element may include a first region, which is not covered bythe encapsulation element, and a second region, which is adjacent to thefirst region and is covered with the encapsulation element. The driverchip may be provided on the first region, and at least a portion of thefilling element may be overlapped with the driver chip in the seconddirection.

In an exemplary embodiment of the inventive concept, the filling elementmay include a first filling element, which is overlapped with the driverchip when viewed in the direction normal to the plane, and a secondfilling element, which is spaced apart from the first filling elementand is not overlapped with the driver chip.

In an exemplary embodiment of the inventive concept, when measured inthe second direction, a width of the first filling element may be lessthan a width of the second filling element.

In an exemplary embodiment of the inventive concept, a plurality of thefirst filling elements may be provided, and when measured in the firstdirection, a distance between each of the first filling elements may belarger than a distance between the second filling element and one of thefirst filling elements adjacent to the second filling element.

In an exemplary embodiment of the inventive concept, the filling elementmay include a first filling element, which is overlapped with the driverchip, and a second filling element, which is spaced apart from the firstfilling element and is not overlapped with the driver chip. The firstfilling element may be spaced apart from the driver chip, when viewed inthe direction normal to the plane.

In an exemplary embodiment of the inventive concept, the display devicemay further include a touch unit provided between the encapsulationelement and the optical element, and a touch flexible circuit boardelectrically connected to the touch unit.

In an exemplary embodiment of the inventive concept, a plurality of thefilling elements may be provided. The filling elements may include afirst filling element and a second filling element, which are arrangedin the first direction with the touch flexible circuit board interposedtherebetween when viewed in the direction normal to the plane, and thefirst filling element and the second filling element may be spaced apartfrom the touch flexible circuit board.

In an exemplary embodiment of the inventive concept, the sealing elementmay include a frit.

In an exemplary embodiment of the inventive concept, the circuit layermay include a thin-film transistor including a semiconductor pattern, acontrol electrode spaced apart from the semiconductor pattern, and inputand output electrodes which are respectively coupled to two portions ofthe semiconductor pattern. The device layer may include an organic lightemitting diode including a first electrode coupled to the thin-filmtransistor, a second electrode provided on the first electrode, and aluminescent layer provided between the first and second electrodes.

According to an exemplary embodiment of the inventive concept, a displaydevice may include a substrate element including a base layer, a circuitlayer provided on the base layer, and a device layer electricallyconnected to the circuit layer, wherein the device layer is configuredto generate light, the base layer forms a plane defined by a firstdirection and a second direction perpendicular to each other, and thesubstrate element includes a first region and a second region adjacentto the first region in the second direction. The display device furtherincludes an encapsulation element provided to cover the second regionand to expose the first region, the encapsulation element including athird region and a fourth region adjacent to the third region in thesecond direction, a sealing element provided along edge regions of theencapsulation element to connect the encapsulation element to thesubstrate element, an optical element provided to cover the fourthregion and to expose the third region, a window element provided on thesubstrate element, an adhesive element provided between the opticalelement and the window element to connect the optical element to thewindow element, and a plurality of filling elements provided between thewindow element and the base layer. The filling elements may be spacedapart from the optical element and the adhesive element and may beoverlapped with a portion of each of the first region and the thirdregion.

In an exemplary embodiment of the inventive concept, the sealing elementmay include an inner side surface defining a hermetically-sealedinternal space, along with the substrate element and the encapsulationelement, and an outer side surface facing the inner side surface, andthe outer side surface may be in contact with at least one of thefilling elements.

In an exemplary embodiment of the inventive concept, a bottom surface ofat least one of the filling elements may be in contact with a portion ofa top surface of the encapsulation element, a side surface of theencapsulation element adjacent to the filling element, a portion of abottom surface of the encapsulation element adjacent to the side surfaceof the encapsulation element, the outer side surface of the sealingelement, and a portion of a top surface of the substrate element.

In an exemplary embodiment of the inventive concept, the display devicemay further include a driver chip that is provided on the first regionand is overlapped with at least one of the filling elements, when viewedin a direction normal to the plane. When measured in the seconddirection, a width of one of the filling elements overlapped with thedriver chip may be less than a width of another of the filling elementsthat is spaced apart from the driver chip.

In an exemplary embodiment of the inventive concept, the display devicemay further include a touch unit provided between the encapsulationelement and the optical element and a touch flexible circuit boardelectrically connected to the touch unit. The filling elements mayinclude a first filling element and a second filling element, which arearranged in the first direction with the touch flexible circuit boardinterposed therebetween when viewed in a direction normal to the plane,and the first filling element and the second filling element may bespaced apart from the touch flexible circuit board.

According to an exemplary embodiment of the inventive concept, a displaydevice may include a substrate element including an organic lightemitting diode for generating light, an encapsulation element providedon the substrate element to seal the organic light emitting diode, asealing element provided along edge regions of the encapsulationelement, the sealing element connecting the encapsulation element to thesubstrate element and including an outer side surface adjacent to theorganic light emitting diode and an inner side surface facing the outerside surface, a window element provided on the substrate element, anadhesive element provided on the encapsulation element, and a fillingelement provided between the window element and the substrate elementand spaced apart from the adhesive element to cover the sealing element.

In an exemplary embodiment of the inventive concept, the filling elementmay be in direct contact with the outer side surface of the sealingelement.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments of the inventive concept will be more clearlyunderstood from the following detailed description taken in conjunctionwith the accompanying drawings.

FIG. 1 is an exploded perspective view of a display device according toan exemplary embodiment of the inventive concept.

FIG. 2 is a sectional view illustrating a portion of the display deviceof FIG. 1 according to an exemplary embodiment of the inventive concept.

FIG. 3 is an equivalent circuit diagram of a pixel according to anexemplary embodiment of the inventive concept.

FIG. 4 is a sectional view illustrating a portion of a display deviceaccording to an exemplary embodiment of the inventive concept.

FIG. 5 is a sectional view of a display device according to an exemplaryembodiment of the inventive concept.

FIG. 6 is an enlarged sectional view illustrating a portion of a displaydevice according to an exemplary embodiment of the inventive concept.

FIG. 7 is a sectional view of a display device according to an exemplaryembodiment of the inventive concept.

FIG. 8 is a sectional view of a display device according to an exemplaryembodiment of the inventive concept.

FIG. 9 is a plan view illustrating a portion of a display deviceaccording to an exemplary embodiment of the inventive concept.

FIG. 10 is a plan view illustrating a portion of a display deviceaccording to an exemplary embodiment of the inventive concept.

FIGS. 11A and 11B are plan views, each of which illustrates a portion ofa display device according to an exemplary embodiment of the inventiveconcept.

FIGS. 12A and 12B are plan views, each of which illustrates a portion ofa display device according to an exemplary embodiment of the inventiveconcept.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Exemplary embodiments of the inventive concept will now be describedmore fully with reference to the accompanying drawings. Exemplaryembodiments of the inventive concept may, however, be embodied in manydifferent forms and should not be construed as being limited to theembodiments set forth herein. In the drawings, the thicknesses of layersand regions may be exaggerated for clarity. Like reference numerals inthe drawings may denote like elements, and thus, their description maybe omitted.

It will be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent.

As used herein, the singular forms “a,” “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise.

FIG. 1 is an exploded perspective view of a display device according toan exemplary embodiment of the inventive concept. FIG. 2 is a sectionalview illustrating a portion of the display device of FIG. 1 according toan exemplary embodiment of the inventive concept. FIG. 3 is anequivalent circuit diagram of a pixel according to an exemplaryembodiment of the inventive concept. FIG. 4 is a sectional viewillustrating a portion of a display device according to an exemplaryembodiment of the inventive concept. Hereinafter, a display device 1000according to an exemplary embodiment of the inventive concept will bedescribed in more detail with reference to FIGS. 1 to 4 .

Referring to FIG. 1 , the display device 1000 may include a windowelement 100, a container element 150, a substrate element 200, anencapsulation element 300, a sealing element 400, a filling element 500,an optical element 600, an adhesive element 700, a flexible circuitboard 800, and a main circuit board 900.

The window element 100 may be divided into a transmission region AA anda light-blocking region BA, when viewed in a plan view. For example, theplan view may be defined by a first direction DR1 and a second directionDR2. The transmission region AA may be optically transparent. Forexample, the transmission region AA may have a transmittance of 90% orhigher. Light emitted from the substrate element 200 may pass throughthe transmission region AA and may be recognized by an outer user. Inother words, the light that passes through the transmission region AAmay be viewed by a person looking at the display device 1000. Thelight-blocking region BA may be adjacent to the transmission region AA.In the present embodiment, the light-blocking region BA may enclose thetransmission region AA. However, the inventive concept is not limitedthereto. For example, the light-blocking region BA may be provided nearonly one side of the transmission region AA. The light-blocking regionBA may have various shapes. For example, the inventive concept is notlimited to the shape of the light-blocking region BA shown in FIG. 1 .

The container element 150 may have an internal space. The substrateelement 200, the encapsulation element 300, the sealing element 400, thefilling element 500, the optical element 600, the adhesive element 700,the flexible circuit board 800, and the main circuit board 900 may beplaced in the internal space of the container element 150. The containerelement 150 may be coupled to the window element 100. The containerelement 150 and the window element 100 may define the outside of thedisplay device 1000.

The filling element 500, which is provided to support the window element100 and the substrate element 200, may also stably maintain a thicknessof a gap region between the window element 100 and the substrate element200. Thus, the filling element 500 may help prevent the display device1000 from being damaged by an external impact.

The substrate element 200 may include a base layer 210, a circuit layer220, and a device layer 230. The circuit layer 220 and the device layer230 may be provided on the base layer 210. The base layer 210 mayinclude a glass substrate, a metal substrate, or a substrate made of anorganic/inorganic composite material.

In exemplary embodiments of the inventive concept, the base layer 210may further include a synthetic resin layer. The synthetic resin layermay include a thermosetting resin.

In addition, at least one inorganic layer, which is used as a barrierlayer and/or a buffer layer, may be further provided on the base layer210. The inorganic layer may be formed of or include aluminum oxide,titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, orhafnium oxide. The inorganic layer may have a multi-layered structure.The multi-layered inorganic layers may be used as a barrier layer and/ora buffer layer. At least one of the barrier layer and the buffer layermay be omitted from the multi-layered structure.

The barrier layer may prevent an external foreign substance from passingthrough the barrier layer. The barrier layer may include a silicon oxidelayer and a silicon nitride layer. The silicon oxide layer and thesilicon nitride layer may be stacked in a sequential or an alternatingmanner.

The buffer layer may allow a layer, which is placed on or below thebuffer layer, to have an increased coupling strength. The buffer layermay include a silicon oxide layer and a silicon nitride layer. Thesilicon oxide layer and the silicon nitride layer may be stackedalternatingly.

The circuit layer 220 and the device layer 230 may include a drivercircuit GDC, a plurality of signal lines SGL, a plurality of pixels PX,and a plurality of signal pads.

The substrate element 200 may include a display region DA, which isprovided to display an image produced by the pixels PX, and anon-display region NDA, which is provided adjacent to the display regionDA. The display region DA may be overlapped with the transmission regionAA of FIG. 1 . The non-display region NDA may be overlapped with thelight-blocking region BA of FIG. 1 .

The driver circuit GDC may be configured to generate a plurality of scansignals and to sequentially output the scan signals to a plurality ofscan lines GL. This will be described in more detail below. In addition,the driver circuit GDC may also be configured to output other controlsignals to the pixels PX.

The signal lines SGL may include scan lines GL, data lines DL, a powerline PL, and a control signal line CSL. Each of the scan lines GL may beconnected to the pixels PX, e.g., a corresponding row or rows of thepixels PX, and each of the data lines DL may be connected to the pixelsPX, e.g., a corresponding column or columns of the pixels PX. The powerline PL may be connected to the pixels PX. The control signal line CSLmay be connected to a scan driver circuit and may be used to delivercontrol signals. At least one signal pad may be connected to acorresponding one of the signal lines SGL.

FIG. 3 is an equivalent circuit diagram of a pixel according to anexemplary embodiment of the inventive concept. FIG. 3 illustrates a scanline GL, a data line DL, a power line PL, and a pixel PX connected tothe scan, data and power lines GL, DL and PL. In an exemplary embodimentof the inventive concept, the pixel PX may include an organic lightemitting diode or a quantum dot light emitting diode serving as a lightemitting device. A luminescent layer of the organic light emitting diodemay include an organic luminescent material. A luminescent layer of thequantum dot light emitting diode may include quantum dots and quantumrods. For simplicity, the description that follows will refer to anexample in which an organic light emitting diode is used as the pixelPX.

The pixels PX may be classified into a plurality of groups, according todisplay colors of the pixels PX. For example, the pixels PX may includered pixels, green pixels, and blue pixels. In an exemplary embodiment ofthe inventive concept, the pixels PX may further include white pixels.

The pixel PX may include an organic light emitting diode OLED and apixel driver circuit for driving the organic light emitting diode OLED.In the present embodiment, the pixel driver circuit may include a firstthin-film transistor T1 (or a driving transistor), a second thin-filmtransistor T2 (or a switching transistor), and a capacitor Cst. A firstpower voltage ELVDD may be provided to the organic light emitting diodeOLED. A second power voltage ELVSS may be lower than the first powervoltage ELVDD. The second power voltage ELVSS may be connected to aterminal of the organic light emitting diode OLED.

The first thin-film transistor T1 may be connected to the organic lightemitting diode OLED. The first thin-film transistor T1 may be used tocontrol a driving current flowing through the organic light emittingdiode OLED, depending on an amount of electric charges stored in thecapacitor Cst. The second thin-film transistor T2 may be configured tooutput a data signal applied to the data line DL, in response to a scansignal applied to the scan line GL. The capacitor Cst may be charged tohave a voltage corresponding to the data signal to be output from thesecond thin-film transistor T2.

The structure of the pixel PX is not limited to that shown in FIG. 3 .For example, the structure of the pixel PX may be variously changed. Forexample, the pixel driver circuit may include three or more thin-filmtransistors.

FIG. 4 is a sectional view illustrating a portion of a display deviceaccording to an exemplary embodiment of the inventive concept. Anexample of a display device will be described in more detail withreference to FIGS. 1 and 4 . The sectional view of FIG. 4 illustrates aportion of the pixel PX, taken along line I-I′ of FIG. 2 . The firstthin-film transistor T1 and the organic light emitting diode OLED, whichare parts of the pixel PX, are illustrated in FIG. 4 . In addition, FIG.4 illustrates how the encapsulation element 300 and the sealing element400 are placed on the substrate element 200.

The first thin-film transistor T1 may include a semiconductor patternSP, a control electrode GE, an input electrode SE, and an outputelectrode DE. The semiconductor pattern SP may be provided on the baselayer 210. The semiconductor pattern SP may be formed of or include acrystalline semiconductor material or an amorphous silicon.

A first insulating layer IL1 may be provided on the base layer 210. Thefirst insulating layer IL1 may be overlapped with a plurality of thepixels PX (e.g., see FIG. 2 ) and cover the semiconductor patterns SP ofthe pixels PX. The first insulating layer IL1 may be an inorganic layerand/or an organic layer and may have a single- or multi-layeredstructure. The first insulating layer IL1 may be formed of or includealuminum oxide, titanium oxide, silicon oxide, silicon oxynitride,zirconium oxide, or hafnium oxide.

The control electrode GE may be provided on the first insulating layerIL1. The control electrode GE may be overlapped with the semiconductorpattern SP.

A second insulating layer IL2 may be provided on the first insulatinglayer IL1. The second insulating layer IL2 may cover the firstinsulating layer IL1 and the control electrode GE. The second insulatinglayer IL2 may be overlapped with the plurality of the pixels PX (e.g.,see FIG. 2 ). The second insulating layer IL2 may be an inorganic layerand/or an organic layer and may have a single- or multi-layeredstructure. The second insulating layer IL2 may be formed of or includealuminum oxide, titanium oxide, silicon oxide, silicon oxynitride,zirconium oxide, or hafnium oxide.

The input electrode SE and the output electrode DE may be provided onthe second insulating layer IL2. Each of the input and output electrodesSE and DE may be connected to the semiconductor pattern SP through acorresponding one of contact holes CH1 and CH2, which are formed in theinsulating layers IL1 and IL2.

A third insulating layer IL3 may be provided on the second insulatinglayer IL2 to cover the first thin-film transistor T1. The thirdinsulating layer IL3 may be an inorganic layer and/or an organic layerand may have a single- or multi-layered structure. The third insulatinglayer IL3 may be formed of or include aluminum oxide, titanium oxide,silicon oxide, silicon oxynitride, zirconium oxide, or hafnium oxide.

The organic light emitting diode OLED may be provided on the thirdinsulating layer IL3. The organic light emitting diode OLED may includea first electrode AE, a first charge control layer HCL, a luminescentlayer EML, a second charge control layer ECL, and a second electrode CE.In the present embodiment, the first electrode AE may correspond to ananode electrode, and the second electrode may correspond to a cathodeelectrode CE of the organic light emitting diode OLED. The first chargecontrol layer HCL may be hole control layer and second charge controllayer ECL may be an electron control layer ECL.

However, the inventive concept is not limited to the above example. Forexample, the first electrode AE, the first charge control layer HCL, theluminescent layer EML, the second charge control layer ECL, and thesecond electrode CE may be used as a cathode electrode, an electroncontrol layer, a luminescent layer, a hole control layer, and an anodeelectrode, respectively.

The first electrode AE may be connected to the output electrode DEthrough a third contact hole CH3, which is formed to penetrate the thirdinsulating layer IL3.

A pixel definition layer PDL may be provided on the third insulatinglayer IL3. The pixel definition layer PDL may have an opening OPexposing at least a portion of the first electrode AE. The opening OP ofthe pixel definition layer PDL may define a light emitting region PXA ofthe pixel PX. Regions, in which the pixels PX are provided, may bereferred to as ‘pixel regions’, and each of the pixel regions mayinclude the light emitting region PXA and a non-light-emitting regionNPXA adjacent to the light-emitting region PXA. The non-light-emittingregion NPXA may enclose the light emitting region PXA. Each of the lightemitting region PXA and the non-light-emitting region NPXA, which areprovided in each of the pixels PX, may be overlapped with the displayregion DA shown in FIG. 2 .

The first charge control layer HCL may be commonly provided in the lightemitting region PXA and the non-light-emitting region NPXA. A commonlayer, such as the first charge control layer HCL, may cover a pluralityof the pixels PX in common. The first charge control layer HCL may beused to control hole motion. For example, the first charge control layerHCL may include a hole transport layer and a hole injection layer.

The luminescent layer EML may be provided on the first charge controllayer HCL. The luminescent layer EML may be locally provided on only aregion corresponding to the opening OP. For example, the luminescentlayer EML may be divided into a plurality of patterns that are formed inthe plurality of pixels PX, respectively.

The second charge control layer ECL may be provided on the luminescentlayer EML. The second charge control layer ECL may be used to controlelectron motion. For example, the second charge control layer ECL mayinclude an electron transport layer and an electron injection layer.

The second electrode CE may be provided on the second charge controllayer ECL. The second electrode CE may be a common electrode or anegative electrode.

In the case where the organic light emitting diode OLED is atop-emission type organic light emitting diode OLED, the first electrodeAE may be a reflective electrode and the second electrode CE may be atransparent or transflective electrode. In the case where the organiclight emitting diode OLED is a bottom-emission type organic lightemitting diode OLED, the first electrode AE may be a transparent ortransflective electrode and the second electrode CE may be a reflectiveelectrode.

The encapsulation element 300 may be provided on the substrate element200. The encapsulation element 300 may cover the display region DA. Theencapsulation element 300 may be provided in the form of a glass orplastic substrate. However, the inventive concept is not limitedthereto. For example, the encapsulation element 300 may be formed of orinclude organic or inorganic materials.

The substrate and encapsulation elements 200 and 300 may be connected toeach other by the sealing element 400. The sealing element 400 may beprovided along edge regions of the encapsulation element 300, which areparallel to the first direction DR1 or the second direction DR2. In anexemplary embodiment of the inventive concept, when viewed in a planview, the edge regions may be outer regions of the encapsulation element300 overlapped with the non-display region NDA of the substrate element200. The sealing element 400 may include a frit. The sealing element400, along with the encapsulation element 300, may prevent the organiclight emitting diode OLED from being exposed to external moisture andair.

The sealing element 400 may have a specific thickness in an area betweenthe substrate and encapsulation elements 200 and 300. Thus, thesubstrate element 200, the encapsulation element 300, and the sealingelement 400 may define an internal space INR. The internal space INR maybe substantially maintained in a vacuum state. However, the inventiveconcept is not limited thereto, and the internal space INR may be filledwith nitrogen gas (N₂) or an insulating material. In an exemplaryembodiment of the inventive concept, the sealing element 400 may beoverlapped with the non-display region NDA of FIG. 2 . For example, thesealing element 400 may be provided between the substrate andencapsulation elements 200 and 300 and may be overlapped with thenon-display region NDA, when viewed in a plan view. Although FIG. 4illustrates an example in which the sealing element 400 is directlyprovided on the second electrode CE, the inventive concept is notlimited to this example. As an example, an insulating layer, which isformed of inorganic or organic materials, may be provided to cover thesecond electrode CE, and the sealing element 400 may be provided on theinsulating layer covering the second electrode CE. Furthermore, in anexemplary embodiment of the inventive concept, the pixel definitionlayer PDL and the insulating layers IL1, IL2, and IL3 may be omittedfrom a region corresponding to the non-display region NDA of FIG. 4 . Inthis case, the sealing element 400 may be directly provided on the baselayer 210.

The filling element 500 may be provided between the window element 100and the substrate element 200. The filling element 500 may fill a gapregion between the window element 100 and the substrate element 200. Inaddition, since the filling element 500 is used to stably maintain athickness of a gap region between the window element 100 and thesubstrate element 200, the filling element 500 can be used to stablyprotect the device layer 230 from an external impact. The fillingelement 500 may be formed of or include an insulating material. Forexample, the filling element 500 may be formed of or include photo- orthermo-curable materials. The filling element 500 will be described inmore detail below.

The optical element 600 may be provided between the window element 100and the encapsulation element 300. The optical element 600 may beoverlapped with the transmission region AA. The optical element 600 maybe configured to increase brightness of an image generated by the devicelayer 230 or to suppress visibility deterioration, which is caused bythe reflection of external light. For example, the optical element 600may include a polarization film, an optical compensation film, or acolor filter. The adhesive element 700 may be provided between theoptical element 600 and the window element 100. The adhesive element 700may be used to attach the window element 100 to the optical element 600.The adhesive element 700 may be overlapped with the transmission regionAA.

Accordingly, the adhesive element 700 may include a transparent adhesivematerial. For example, the adhesive element 700 may include an opticalclear adhesive (OCA), an optical transparent resin (OCR), or a pressuresensitive adhesive (PSA).

The flexible circuit board 800 may include a flexible film 810 and adriver chip 820. The flexible circuit board 800 may be provided near oneside of the substrate element 200 and may include output pads, which arecoupled to the signal pads. Thus, the flexible circuit board 800 may beused to electrically connect at least one of the signal lines SGL to themain circuit board 900.

The flexible film 810 may have a flexible property and may include aplurality of circuit lines.

The driver chip 820 may be mounted on the flexible film 810 in achip-on-film (COF) manner. The driver chip 820 may include drivingdevices (e.g., a data driver circuit) for driving the pixels PX.Although one flexible circuit board 800 is illustrated, the inventiveconcept is not limited thereto. For example, a plurality of flexiblecircuit boards 800 may be coupled to the substrate element 200.

The main circuit board 900 may be coupled to input pads of the flexiblecircuit board 800 and may be electrically connected to at least one ofthe signal lines SGL through the flexible circuit board 800. In anexemplary embodiment of the inventive concept, the main circuit board900 may be a flexible printed circuit board (FPCB).

The main circuit board 900 may include a signal control unit (e.g., atiming controller). The signal control unit may be configured to receiveinput image signals and to convert the input image signals to image datasuitable for operations of the pixels PX. In addition, the signalcontrol unit may also be configured to receive a variety of controlsignals (e.g., a vertical synchronization signal, a horizontalsynchronization signal, a main clock signal, and a data enable signal)and to output the control signals.

FIG. 5 is a sectional view of a display device according to an exemplaryembodiment of the inventive concept. FIG. 6 is an enlarged sectionalview illustrating a portion of a display device according to anexemplary embodiment of the inventive concept. Hereinafter, the displaydevice 1000 will be described with reference to FIGS. 5 and 6 . In thefollowing description, the sealing element 400 is illustrated in anenlarged manner.

In the present embodiment, a first region A1 and a second region A2 maybe defined in the substrate element 200. A portion of the first regionA1 may not be covered by the encapsulation element 300 and a portion ofthe first region A1 may be overlapped with a portion of the fillingelement 500. The second region A2 may be adjacent to the first region A1in the second direction DR2 and may be covered with the encapsulationelement 300.

A third region A3 and a fourth region A4 may be defined in theencapsulation element 300. The third region A3 may not be covered by theoptical element 600 and may be overlapped with a portion of the fillingelement 500. The fourth region A4 may be adjacent to the third region A3in the second direction DR2 and may be covered with the optical element600. In the present embodiment, the filling element 500 may beoverlapped with a portion of each of the window and substrate elements100 and 200. The filling element 500 may be spaced apart from theoptical element 600 and the adhesive element 700.

In the present embodiment, a light-blocking layer BM may be provided onthe light-blocking region BA. The light-blocking layer BM may be formedof or include a black material. The light-blocking layer BM may beprovided under the window element 100 and may be formed by a printing ordeposition process. In an exemplary embodiment of the inventive concept,the filling element 500 may be overlapped with the light-blocking layerBM and may be overlapped with a portion of each of the first region A1and the third region A3. When measured in the second direction DR2, awidth W1 (hereinafter, a first width) of the filling element 500 may begreater than a width W2 (hereinafter, a second width) of the sealingelement 400. When viewed in a plan view, the filling element 500 maycover the sealing element 400.

As shown in FIG. 6 , a bottom surface 500C (or bottom area) of thefilling element 500 may be in direct contact with a portion of a topsurface 300A, a side surface 300B, and a portion of a bottom surface300C of the encapsulation element 300. In addition, the bottom surface500C (or bottom area) of the filling element 500 may be in directcontact with an outer side surface 400A of the sealing element 400, anda portion of a top surface 200A of the substrate element 200. In thepresent embodiment, an inner side surface 400D of the sealing element400 facing the outer side surface 400A, along with the substrate andencapsulation elements 200 and 300, may define the internal space INRthat is hermetically sealed. In other words, the inner side surface 400Dmay be closer to the organic light emitting diode OLED (e.g., see FIG. 4) than the outer side surface 400A.

Since the display device 1000 includes the filling element 500 that isin direct contact with the outer side surface 400A of the sealingelement 400, it is possible to prevent the sealing element 400 fromhaving a weakened adhesion strength due to an external impact or aforeign substance. In addition, since the display device 1000 includesthe filling element 500 that is in direct contact with the outer sidesurface 400A of the sealing element 400, it is possible to prevent thesubstrate element 200 and the encapsulation element 300 from beingdecoupled from each other due to the cracking of the sealing element400. In addition, since the filling element 500 is used to maintain agap region between the substrate element 200 and the window element 100,it is possible to increase a mechanical strength of the display device1000.

During a fabrication process, there may be a difference in curing levelsand materials between the filling and adhesive elements 500 and 700.Thus, in the case where the filling element 500 is in partial contactwith the adhesive element 700, due to a difference in refractive indexbetween a contacting portion and a non-contacting portion, thecontacting portion may be recognized by an external user. Suchrecognition by the external user is unwanted. According to an exemplaryembodiment of the inventive concept, since the filling element 500 isprovided adjacent to the adhesive element 700, it is possible to preventthe filling and adhesive elements 500 and 700, which are formed ofdifferent materials, from being mixed with each other in a curing step.Therefore, the contacting portion is prevented from being recognized bya user. As a result, it is further possible to provide the displaydevice 1000 with increased reliability.

FIG. 7 is a sectional view of a display device according to an exemplaryembodiment of the inventive concept. Hereinafter, an element previouslydescribed with reference to FIGS. 1 to 6 identified by the samereference number in FIG. 7 may not be repeatedly described. In anexemplary embodiment of the inventive concept, a filling element 500-1may be overlapped with a portion of the light-blocking region BA of thewindow element 100 and portions of the substrate and encapsulationelements 200 and 300. The filling element 500-1 may partially cover atop surface 800A and a side surface 800C of the flexible circuit board800. In the present embodiment, since the filling element 500-1 coversthe flexible circuit board 800, it is possible to prevent an externalforeign substance from entering the display device 1000 and to increasea mechanical strength of the display device 1000.

FIG. 8 is a sectional view of a display device according to an exemplaryembodiment of the inventive concept. Hereinafter, an element previouslydescribed with reference to FIGS. 1 to 6 identified by the samereference number in FIG. 8 may not be repeatedly described.

According to an exemplary embodiment of the inventive concept, a displaydevice 1000-1 may further include a driver chip DI. In the presentembodiment, the driver chip DI may include driving devices (e.g., a datadriver circuit) for driving the pixels PX.

In the present embodiment, a filling element 500-2 may be provided topartially cover a top surface DI-A and a side surface DI-C of the driverchip DI. However, the inventive concept is not limited to this example.For example, the filling element 500-2 may be provided to wholly coverthe driver chip DI. Since the filling element 500-2 is provided topartially or wholly cover the sealing element 400 and the driver chipDI, it is possible to increase a mechanical strength of the displaydevice 1000-1.

FIG. 9 is a plan view illustrating a touch unit of a display deviceaccording to an exemplary embodiment of the inventive concept.

A touch unit TU may be configured to obtain information on coordinatesof an external input. The touch unit TU may be directly provided on theencapsulation element 300. In an exemplary embodiment of the inventiveconcept, the touch unit TU may be directly formed on the encapsulationelement 300. Accordingly, an additional adhesive layer between the touchunit TU and the encapsulation element 300 may be omitted. However, theinventive concept is not limited thereto. For example, the touch unit TUmay be provided in the form of an individual panel and may be coupled tothe encapsulation element 300 through an additional adhesive element.

The touch unit TU may include a touch sensor, in which a plurality ofconductive layers are provided, and a plurality of insulating layers.Each of the insulating layers may have a single-layered structure or amulti-layered structure including layers, which are stacked in a thirddirection DR3.

The touch unit TU may include an active region AR, which is used tosense an external input corresponding to the transmission region AA ofFIG. 1 , and a non-active region NAR, which is provided to surround theactive region AR. The active region AR and the non-active region NAR maycorrespond to the transmission region AA and the light-blocking regionBA, respectively, of FIG. 1 .

One of the conductive layers of the touch sensor may include firstsensing electrodes IE1 and first signal lines SL1, which are connectedto the first sensing electrodes IE1, and another conductive layer of thetouch sensor may include second sensing electrodes IE2 and second signallines SL2, which are connected to the second sensing electrodes IE2.

The first sensing electrodes IE1 and the second sensing electrodes IE2may cross each other. The first sensing electrodes IE1 may be arrangedin the second direction DR2, and each of the first sensing electrodesIE1 may be extended in the first direction DR1. The touch unit TU may beconfigured to sense an external input in a mutual-capacitance and/orself-capacitance manner.

Each of the first sensing electrodes IE1 may include first sensor unitsSP1 and first connecting portions CPL. Each of the second sensingelectrodes IE2 may include second sensor units SP2 and second connectingportions CP2.

In an exemplary embodiment of the inventive concept, the first sensingelectrodes IE1 and the second sensing electrodes IE2 may have a shape(e.g., a bar shape), in which the sensor unit and the first and secondconnecting portions CP1 and CP2 are not distinguished. The first sensorunits SP1 and the second sensor units SP2 are illustrated to have adiamond shape, but the inventive concept is not limited thereto. Forexample, at least one of the first and second sensor units SP1 and SP2may have a polygonal shape.

The first signal lines SL1 and the second signal lines SL2 may beoverlapped with the active region AR and the non-active region NAR. Thefirst signal lines SL1 and the second signal lines SL2 may be connectedto corresponding touch pads TD, respectively.

FIGS. 10 to 12B are plan views, each of which illustrates a portion of adisplay device according to an exemplary embodiment of the inventiveconcept. Hereinafter, an element previously described with reference toFIGS. 1 to 5 identified by the same reference number in FIGS. 10 to 12Bmay not be repeatedly described.

In an exemplary embodiment of the inventive concept, the display device1000 may further include a touch flexible circuit board TF, which iscoupled to the touch pads TD of FIG. 9 . The touch flexible circuitboard TF may be provided at an edge region of the encapsulation element300 (e.g., the third region A3 of FIG. 5 ) and may be used toelectrically connect the touch unit TU to the main circuit board 900(e.g., see FIG. 1 ). The touch flexible circuit board TF may have aflexible property and may include a plurality of circuit lines. Thetouch flexible circuit board TF may be used to deliver touch sensingsignals from the main circuit board 900 to the touch unit TU.

In an exemplary embodiment of the inventive concept, a plurality offilling elements 500-3 may be provided, as shown in FIG. 10 . Thefilling elements 500-3 may include a first filling element 501 and asecond filling element 502, which are spaced apart from each other withthe touch flexible circuit board TF interposed therebetween. Each of thefirst and second filling elements 501 and 502 may be spaced apart fromthe touch flexible circuit board TF by a separation space OZ. Thefilling elements and the touch flexible circuit board TF in FIGS. 11A to12B may be arranged in the same manner as those described with referenceto FIG. 10 . Accordingly, descriptions thereof may be omitted below.

In the present embodiment, since the touch flexible circuit board TF isnot in contact with the first and second filling elements 501 and 502,it is possible to prevent or suppress a material of the first and secondfilling elements 501 and 502 from entering a space between the touchflexible circuit board TF and the substrate element 200 due to acapillary phenomenon, which may occur when the first and second fillingelements 501 and 502 are formed.

In an exemplary embodiment of the inventive concept, a plurality offilling elements 500-4 may be provided, as shown in FIG. 11A. Forexample, the filling elements 500-4 may include a third filling element503 and a fourth filling element 504, which are spaced apart from eachother with the touch flexible circuit board TF interposed therebetween,and a fifth filling element 505. The fourth filling element 504 may beoverlapped with the driver chip DI (e.g., see also FIG. 8 ), when viewedin the second direction DR2. However, the fourth filling element 504 andthe driver chip DI may be spaced apart from each other, when viewed in aplan view. When measured in the second direction DR2, a third width W3of the fourth filling element 504 may be smaller than a fourth width W4of the fifth filling element 505.

The adhesive element 700 (e.g., see FIG. 1 ) may be cured by ultravioletlight incident through the side surface of the display device 1000. Theultraviolet light may be incident through a space between the driverchip DI and the window element 100. In this case, a transmission amountof the ultraviolet light may be decreased depending on a thickness ofthe driver chip DI. In the present embodiment, a width of the fourthfilling element 504 (e.g., W3) overlapped with the driver chip DI in thesecond direction DR2 may be decreased. In this case, it is possible toreduce the transmission amount of the ultraviolet light, which is causedby the thickness of the driver chip DI, and thereby to suppress areduction in a curing rate of the adhesive element 700.

Referring to FIG. 11B, a plurality of filling elements 500-4A mayinclude a third filling element 503A, a fourth filling element 504A, anda fifth filling element 505A. At least a portion of the fourth fillingelement 504A is overlapped with the driver chip DI when viewed in a planview. In addition, when viewed in a plan view, the fourth fillingelement 504A may fully cover the driver chip DI. Thus, it is possible toprevent a foreign substance from entering the driver chip DI.Furthermore, since at least a portion of the driver chip DI is coveredwith the fourth filling element 504A, it is possible to increase amechanical strength of the display device 1000.

In an exemplary embodiment of the inventive concept, as shown in FIG.12A, filling elements 500-5 may be dot-shaped patterns, and at least two(e.g., 508 and 506) of the filling elements 500-5 may be spaced apartfrom each other with the touch flexible circuit board TF interposedtherebetween. The dot-shaped filling elements 500-5 may have differentshapes. In the present embodiment, the filling elements 500-5 mayinclude sixth filling elements 506, which are overlapped with the driverchip DI in the second direction DR2, and a seventh filling element 507,which is not overlapped with the driver chip DI. When measured in thefirst direction DR1, a distance (hereinafter, a fifth width W5) betweenthe sixth filling elements 506 may be larger than a distance(hereinafter, a sixth width W6) between the seventh filling element 507and one of the sixth filling elements 506 adjacent to the seventhfilling element 507.

Referring to FIG. 12B, a plurality of filling elements 500-5A mayinclude sixth filling elements 506A, seventh filling elements 507A andeighth filling elements 508A. At least a portion of sixth fillingelements 506A is overlapped with the driver chip DI, when viewed in aplan view. In addition, when viewed in a plan view, at least one of thesixth filling elements 506A may fully cover the driver chip DI. Thus, itis possible to prevent a foreign substance from entering the driver chipDI. Furthermore, since at least a portion of the driver chip DI iscovered with the sixth filling elements 506A, it is possible to increasea mechanical strength of the display device 1000.

The adhesive element 700 (e.g., see FIG. 1 ) may be cured by ultravioletlight incident through the side surface of the display device 1000. Theultraviolet light may be incident through a space between the driverchip DI and the window element 100. Here, a distance between the fillingelements 500-5A overlapped with the driver chip DI may be increased.Therefore, it is possible to reduce the transmission amount of theultraviolet light, due to the thickness of the driver chip DI, and tosuppress a reduction in a curing rate of the adhesive element 700.

According to exemplary embodiments of the inventive concept, it ispossible to stably maintain a thickness of a gap region between a windowelement 100 and a substrate element 200 and thereby to stably protect adevice layer 230 from an external impact. Furthermore, it is possible toprotect a sealing element 400, which is used to connect the substrateelement 200 to an encapsulation element 300, and to prevent a displaydevice 1000 from failure due to external moisture or contamination. As aresult, it is possible to increase operation reliability of the displaydevice 1000.

While the inventive concept has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be understoodby one of ordinary skill in the art that variations in form and detailmay be made thereto without departing from the spirit and scope of theinventive concept as defined by the attached claims.

What is claimed is:
 1. A display device, comprising: a substrate elementincluding a base layer, a circuit layer on the base layer, and a devicelayer electrically connected to the circuit layer, wherein the devicelayer is configured to generate light; an encapsulation element disposedon the substrate element to cover the device layer; a window elementdisposed on the substrate element; and a filling element disposedbetween the window element and the substrate element, wherein thefilling element contacts at least a portion of a side surface of theencapsulation element and a first portion of a top surface of theencapsulation element, and does not overlap a second portion of the topsurface of the encapsulation element.